Laser because of its excellent physical properties can be a variety of metals, non-metallic processing, in particular, can be processed with high hardness, high brittleness and high melting point of the material, suitable for high-end materials, fine processing. Laser processing has the characteristics of good cutting quality, high cutting efficiency and fast cutting speed, which has outstanding advantages compared to the traditional contact machining. At the same time, the high power laser pointer processing system and computer numerical control technology combining a intelligent automatic processing equipment, has become a key technology in the implementation of sheet metal processing industry enterprises; and picosecond and femtosecond ultrafast laser and ultraviolet laser and other new laser technology, non metal material processing in the field of consumer electronics industry showed strong demand. 2025 of the manufacturing strategy in the background of Chinese, traditional industrial manufacturing industry faces deep transformation, which at the same time in one direction is to improve the efficiency of steering high-end precision machining with higher added value and higher technical barriers. The laser processing complies fully with this theme, lasers and laser processing equipment has touch screen module for semiconductor wafer production, a scribing and other high-end 3C in the manufacture of consumer electronics, and show new prospects in sapphire processing, curved glass and ceramic production and other fields.

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Picosecond 5000mw laser pointer processing to lead the new direction of 3C industry. As a typical representative of ultrashort picosecond laser pulse laser, ultrashort pulse with high peak power, the characteristics of the processing object, especially suitable for the processing of sapphire, glass, brittle materials such as ceramics and heat sensitive materials, so it is suitable for micro machining industry application in electronic industry. In the past two years, the demand for processing equipment is rapidly improving. The main reason is that the application of the fingerprint identification module on the mobile phone from last year has led to the purchase of special equipment. The fingerprint module relates to the laser processing link: wafer dicing, chip cutting, plate cutting, FPC soft plate shape cutting drilling, laser marking etc.. Which is mainly Sapphire / glass cover and IC chip processing. From the beginning of 2015 6 Apple official use of fingerprint identification also led to the popularity of a number of domestic brands, the fingerprint recognition penetration of less than 50%, so for picosecond machine fingerprint recognition module is still larger space for development.

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At the same time, picosecond machine can also be used in PCB wafer dicing drilling, cutting, applying field is widening. In particular, with the application of high value-added materials such as sapphire and ceramics in the future, the picosecond laser processing equipment will become an important part of the 3C automation equipment. We believe that in the field of 3C automated processing equipment, the future of picosecond http://www.everyonetobuy.com/100mw-powerful-blue-violet-laser-pointer.html or will play a broad and profound role.

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