At present, laser processing has been widely used in laser marking, laser drilling, burning laser pointer cutting and welding, surface modification of materials, laser rapid prototyping, laser composite processing and so on. In the manufacture of smart phone components, laser processing technology can be seen everywhere, such as mobile phone shell cutting, marking, welding, motherboard manufacturing, keyboard chip markers and earphones, headphones, accessories carving and drilling and so on. In the process of marking, the general use of fiber laser marking machine for information related to the mark.

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Although in today's many micro-processing applications, we can use nanosecond laser marking machine to achieve, but in the degree of refinement above there are still some deficiencies. The main reason is the use of this laser equipment for mobile phone micro-processing mark, it is easy to give mobile phone-related fine products to give more heat, resulting in melting, cracking, surface composition changes and other harmful side effects. However, with the current picosecond laser marking machine, you can in the mobile phone fine mark to achieve the real heat-free processing. In the actual marking process, the use of picosecond laser equipment in the mobile phone-related products above the realization of high-speed, high-quality fine markings, and nanosecond green astronomy laser equipment is often difficult to achieve the same quality, and easy to produce various defects. A series of related problems, including edge bumps, melting, debris, substrate cracking or damage, are caused by the heating of the surface of the mark due to the long nanosecond pulse.

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In addition to avoiding thermal defects, the use of today's picosecond laser devices can also improve the processing efficiency. Fine machining of mobile phone related parts using other marking equipment, interaction for a long time, which lead to more waste of energy, so the heat to melt, also can spread rapidly in the processing of modified area. On the other hand, picosecond laser equipment has a very short interaction times, almost all energy related products directly through the mobile phone parts strongest laser pointer pulse acts perpendicular to the mark, to achieve instant laser ablation, and the processing efficiency is very high.

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