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2017-09-14 12:26
LED Laser Processing Technology

Laser Scoring LED scribe lines are much narrower than traditional mechanical scribing, resulting in a significant increase in material utilization, thus increasing output efficiency. In addition, laser processing is a non-contact process, scribe to bring wafer microcracks and other damage smaller, which makes the wafer between the more compact, high output efficiency, high production capacity, while the finished LED device reliability is also great improve.

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Laser processing is a non-contact processing, as a traditional mechanical saw blade cutting alternative technology, laser scribe incision is very small, the focus of the laser pointer after the fine spot effect on the wafer surface, rapid gasification material, made between the LED active area Small incision, which can be in the limited area of the wafer cut out more LED monomer. Laser scribing is particularly good for gallium arsenide (GaAs) and other brittle compounds. Laser processing LED wafers, the typical scribe depth of the substrate thickness of 1/3 to 1/2, so that the division can be a clean fracture surface, the manufacture of narrow and deep laser scribing cracks while ensuring high-speed characterization speed, which requires the laser with narrow pulse width, high beam quality, high peak power, high repetition frequency and other excellent quality.

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Not all of the lasers are suitable for LED characterization because of the transmittance of the wafer material for the visible wavelength laser. GaN is transmitted for light having a wavelength of less than 365 nm, and the sapphire wafer is semi-transmissive to a laser having a wavelength greater than 177 nm, so that the Q-switched all solid-state laser (DPSSL) with three or four times the wavelength of 355 nm and 266 nm is the LED crystal The best choice for circular red laser scribing. Although excimer lasers can also achieve the wavelengths required for LED characterization, the full-frequency Q-switched lasers are much smaller, much less accurate than excimer lasers, and the quality of all-solid lasers is very narrow and more suitable Marking in the laser LED.

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Laser scribing makes wafer microcracks and microcracks greatly reduced, and the distance between the LEDs is closer, thus improving the productivity and increasing the productivity. In general, 2-inch wafers can separate more than 20,000 LED monolithic devices, such a high density, so that the cut width of the slit will significantly affect the number of fractions and reduce microcracks The long-term reliability of LED devices will be significantly improved. Laser cutting more than the traditional blade cutting not only improve the output efficiency, while improving the processing speed, to avoid the blade wear caused by defects in processing and cost loss, in short, high precision astronomy laser pointer processing, processing tolerances, low cost.

 

The advantages of laser for LED scribing are clear, but also face many technical challenges, such as different materials, thickness, different cases of scoring speed and other differences. The laser can provide 100fs automatic femtosecond pulse laser, designed for industrial applications, solid and reliable. When the short-peak high-peak power spectrum-physical laser acts on the LED substrate, the effect is: scribe lines clean, the material position is small, the thermal effect of the substrate damage is very small.

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2017-09-14 12:26